The New world of Advanced packaging

Innovation and flexibility… forward-looking concepts and strategies… a strong focus on customer success – these are keys to Datacon´s leading position in the advanced packaging market. The unique apm platform concept introduced in 1998 was an industry breakthrough, setting new standards in semiconductor pakkage assembly.With the apm platform, Datacon quickly achieved technology innovations for a broad range of customer applications. From automotive to telecommunications to consumer and industrial electronics – Datacon has led the market, providing innovative solutions for the world of advanced packaging.
One of the hottest trends in advanced packaging today is the rapid adoption of flip chip technology for applications like wireless and portable consumer devices, intelligent labels and high-powered components for medical electronics. Thanks to innovations in die, materials and substrates, flip chip technology now enables significant performance, size and cost advantages for these applications.
Datacon’s key to your flip chip success: Don´t sacrifice process time to guarantee process stability!

Online Flip Chip Die Bonder by flip-chip-die-bonder.com